"Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules"
published by Engineering, Vol.8 No.9, 2016
has been cited by the following article(s):
Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module
Effects of Particle Size of Al2O3 on the Mechanical Properties and Micro-Structures of Al2O3-3YSZ Composites