Shih, H. (2012) A Systematic Study and Characterization of Advanced Corrosion Resistance Materials and Their Applications for Plasma Etching Processes in Semiconductor Silicon Wafer Fabrication. In: Shih, H., Ed., Corrosion Resistance, In Tech, München.
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 Shih, H. (2001) Technology Development of Materials Characterization in Wafer Fabrication Equipment. 2001 IC Equipment Supply Chain Symposium and Tainan Manufacturing Center Opening, Taiwan, 4th May 2001.
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 Shih, H. (2000) Defect Density Reduction of 0.18μm and Beyond. Presentation on SEMICON Korea, Seoul, Korea.
 Shih, H. (2000) Defect Density Reduction and Productivity Enhancement for 0.18μm and Beyond. AMSEA 7th Annual Technical Seminar at Singapore, Singapore, May 2000.
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 Shih, H. and Barber, P. (2003) Materials Laboratory Development for Anodized Aluminum Study and Supplier Qualification—Part one and Part Two. Lam Research Confidential Technical Report.
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 Shih, H. and Daugherty, J. (2009) EIS Data Explanation of Anodized Aluminum 6061-T6 after Thermal Cycling. Lam Research Confidential Technical Report, Lam Research Corporation.
 Huang, Y.L., Shih, H., Huang, T.C., Daugherty, J., Wu, S., Ramanathan, S., Chang, C. and Mansfeld, F. (2008) Evaluation of the Properties of Anodized Aluminum 6061-T6 Using Electrochemical Impedance Spectroscopy (EIS). Journal of Corrosion Science, 50, 3569-3575.
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 Shih, H. (2006) Electrochemical Impedance Spectroscopy (EIS) Technology and Applications. Lecturer for a Short Course Sponsored by the San Francisco Section of the Electrochemical Society, Crown Plaza Hotel, Milpitas, California.
 Fang, Y., Outka, D. and Shih, H. (2008) TEM Analysis of Al6061-T6 Type III Anodization and the Mixed Acid Anodization. Lam Research Confidential Technical Report.
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