Back
 JECTC  Vol.1 No.2 , September 2011
Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling
Abstract: A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.
Cite this paper: nullSundaram, A. and Bhaskaran, A. (2011) Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling. Journal of Electronics Cooling and Thermal Control, 1, 15-21. doi: 10.4236/jectc.2011.12002.
References

[1]   P. Dunn and D. A. Reay, “Heat Pipes,” 4th Edition, Oxford, Burlington, 1994.

[2]   F. Tardy and Samuel M. Sami, “Thermal Analysis of Heat Pipes during Thermal Storage,” Applied Thermal Engineering, Vol. 29, No. 2-3, 2009, pp. 329-333. doi:10.1016/j.applthermaleng.2008.02.037

[3]   H. Jouhara, O. Martinet and A. J. Robinson, “Experimental Study of Small Diameter Thermosyphons Charged with Water, FC-84, FC-77 & FC-3283,” 5th European Thermal-Sciences Conference, Eindhoven, 18-22 May 2008.

[4]   H. Imura, H. Kusada, J. Oyata, T. Miyazaki and N. Saka- moto, “Heat Transfer in Two-PhaseClosed Thermosyphon,” Transactions of Japan Society of Mechanical Engineers, Vol. 22, 1977, pp. 485- 493.

[5]   S. H. Noie, M. H. Kalaei and M. Khoshnoodi, “Experimental Investigation of Boiling and Condensation Heat Transfer of a Two Phase Closed Thermosyphon,” International Journal of Engineering, Vol. 18, No. 1, 2005, pp. 37-43.

[6]   D. E. Briggs and E. H. Young, “Convection Heat Transfer and Pressure Drop of Air Flowing across Triangular Pitch Banks of Finned Tubes,” Chemical Engineering Progress Symposium Series, Vol. 59, No. 41, 1963, pp. 1-10.

[7]   R. E. Simons, “Estimating Parallel Plate-Fin Heat Sink Thermal Resistance,” Calculation Corner-Electronics Cooling, 2000.

[8]   A. Pal and Y. Joshi, “Design and Perfor- mance Evaluation of a Compact Thermosyphon,” Proceedings of the International Conference Thermes 2002, Santa Fe, 13-16 January 2002.

 
 
Top