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 MSCE  Vol.4 No.4 , April 2016
Changing the Growth Behavior of a NiSn-Solder Using Gold
Abstract: In this investigation, the influence of a thin gold (Au) layer on the growth behavior of the intermetallic compound (IMC) in a Nickel-Tin-Solder (NiSn-Solder) was studied. The reaction kinetics was studied in the temperature range of 232 to 330 using cross-sectional scanning electron microscope (SEM) images. The kinetics of the reaction was determined using the empirical power law and the research showed that the introduction of an Au layer changes the reaction kinetics of the solder significantly. Furthermore, the change in reaction kinetics was accompanied by a change in morphology of the developing grains. The grain morphology of the IMC was studied for samples annealed at 290using cross-sectional and top-view samples and compared to Au free NiSn-Solder.
Cite this paper: Wendt, M. , Weimar, A. , Zenger, M. and Dilger, K. (2016) Changing the Growth Behavior of a NiSn-Solder Using Gold. Journal of Materials Science and Chemical Engineering, 4, 31-38. doi: 10.4236/msce.2016.44004.
References

[1]   Wendt, M., Plöβl, A., Weimar, A., Zenger, M. and Dilger, K. (2016) Investigation of the Influence of Annealing Temperature on the Morphology and Growth Kinetic of Ni3Sn4 in the Ni-Sn-Solder System. Journal of Materials Science and Chemical Engineering, 4, 116-130.
http://dx.doi.org/10.4236/msce.2016.42013

[2]   Nakahara, S. and McCoy, R. (1980) Kirkendall Void Formation in Thin-Film Diffusion Couples. Applied Physics Letters, 37, 42-44.
http://dx.doi.org/10.1063/1.91696

[3]   Buene, L., Falkenberg-Arell, H., Gjønnes, J. and Taftø, J. (1980) A Study of Evaporated Gold-Tin Films Using Transmission Electron Microscopy: II. Thin Solid Films, 67, 95-102.
http://dx.doi.org/10.1016/0040-6090(80)90292-8

[4]   Okamoto, H. and Massalski, T.B. (1984) The Au-Sn (Gold-Tin) System. Bulletin of Alloy Phase Diagrams, 5, 492.
http://dx.doi.org/10.1007/BF02872904

[5]   Neumann, A., Kjekshus, A., Romming, C. and Rost, E. (1995) The Crystal Structure of AuNi2Sn4. Journal of Solid State Chemistry, 119, 142-146.
http://dx.doi.org/10.1016/0022-4596(95)80021-G

[6]   Schaefer, M., Fourelle, R.A. and Liang, J. (1998) Theory of Intermetallic Phase Growth between Cu and Liquid Sn-Pb Solder Based on Grain Boundary Diffusion Control. Journal of Electronic Materials, 27, 1167-1176.
http://dx.doi.org/10.1007/s11664-998-0066-7

[7]   Liu, H.S., Wang, J. and Jin, Z.P. (2004) Thermodynamic Optimization of the Ni-Sn Binary System. Calphad, 28, 363- 370.
http://dx.doi.org/10.1016/j.calphad.2004.12.002

[8]   Minor, A.M. and Morris Jr., J.W. (2000) Growth of a Au-Ni-Sn Intermetallic Compound on the Solder-Substrate Interface after Aging. Metallurgical and Materials Transactions A, 31, 798-800.
http://dx.doi.org/10.1007/s11661-000-0022-5

[9]   Glazer, J., Kramer, P. and Morris Jr., J.W. (1991) Effect of Au on the Reliability of Fine Pitch Surface Mount Solder Joints. Proceedings of the Surface Mount International Conference, 1.2, 629-639.

[10]   Görlich, J., Baither, D. and Schmitz, G. (2010) Reaction Kinetics of Ni/Sn Soldering Reaction. Acta Materialia, 58, 3187-3197.
http://dx.doi.org/10.1016/j.actamat.2010.01.027

 
 
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