Use of epoxy as an adhesive
is a common practice. The most common applications are permanent sealants.
Epoxies have a wide range of operating temperatures, and are very resistance to
adhesive failure. When a need to remove this adhesive arises, it is not always
easily accomplished especially if the part has excessive adhesive. To maintain
fidelity of the parts attached by epoxy, a project evaluating several methods
of epoxy removal was conducted. Methods evaluated included low wavelength,
near-ultraviolet radiation, solvent dissolution, and thermal cycling. The UV method
failed to demonstrate a repeatable dissociation. The solvent study did result
in dissociation of bonds, but introduced chemicals that could make subsequent
chemical analysis of parts suspect. Thermal cycling showed a high repeatability
for dissociation of bonds and may prove to be relatively inexpensive to
Cite this paper
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, 196-201. doi: 10.4236/msce.2015.37026
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