[1] Gutmann, R.J. (1999) Advanced Silicon IC Interconnect Technology and Design: Present Trends and RF Wireless Implications. IEEE Transactions on Microwave Theory and Techniques, 47, 667-674.
http://dx.doi.org/10.1109/22.769333
[2] Awaya, N., Inokawa, H., Yamamoto, E., Okazaki, Y., Miyake, M., Arita, Y. and Kobayashi, T. (1996) Evaluation of a Copper Metallization Process and the Electrical Characteristics of Copper-Interconnected Quarter-Micron CMOS. IEEE Transactions on Electron Devices, 43, 1206-1212.
http://dx.doi.org/10.1109/16.506770
[3] Allan, A., Edenfeld, D., Joyner, W.H., Kahng, A.B., Rodgers, M. and Zorian, Y. (2001) The National Technology Roadmap for Semiconductors. Semiconductor Industry Association, 35, 42-53.
[4] Golden, J.H., Hawker, C.J. and Ho, P.S. (2001) Designing Porous Low-k Dielectrics. Semiconductor International, 24, 79-87.
[5] Xu, Y., Chung, D.D.L. and Mroz, C. (2002) Thermally Conducting Aluminum Nitride Polymer-Matrix Composites. Composite: Part A, 32, 1749-1757.
[6] Pezzotti, P., Kamada, I. and Miki, S. (2000) Thermal Conductivity of AlN/Polystyrene Interpenetrating Networks. Journal of the European Ceramic Society, 20, 1197-1203.
http://dx.doi.org/10.1016/S0955-2219(99)00282-4
[7] Lee, H. and Neville, K. (1967) Hand Book of Epoxy Resins. McGrow Hill Book Company, London.
[8] Hodgin, M.J. and Estes, R.H. (1999) Advanced Boron Nitride Epoxy Formulation Excel in Thermal management Applications. Proc. NEPCON Conf., Anaheim, 359-366.
[9] Weidenfeller, B., HÖfer, M. and Schilling, F. (2002) Thermal and Electrical Properties of Magnetite Filled Polymers. Composites Part A: Applied Science and Manufacturing, 33, 1041-1053.
http://dx.doi.org/10.1016/S1359-835X(02)00085-4
[10] Mamuny, Y.P., Davydenko, V.V., Pissis, P. and Lebedev, E.V. (2002) Electrical and Thermal Conductivity of Polymers Filled with Metal Powders. European Polymer Journal, 38, 1887-1897.
http://dx.doi.org/10.1016/S0014-3057(02)00064-2
[11] Pillai, P.K.C., Narula, G.K. and Tripathi, A.K. (1984) Dielectric Properties of Polypropylene/Polycarbonate Polyblends. Polymer Journal, 16, 575-578.
http://dx.doi.org/10.1295/polymj.16.575
[12] Luo, X.C. and Chung, D.D.L. (2001) Carbon-Fiber/Polymer-Matrix Composites as Capacitors. Composites Science and Technology, 61, 885-888.
http://dx.doi.org/10.1016/S0266-3538(00)00166-4
[13] Wang, S.K. and Chung, D.D.L. (2005) The Interlaminar Interface of a Carbon Fiber Epoxy-Matrix Composite as an Impact Sensor. Journal of Materials Science, 40, 1863-1867.
http://dx.doi.org/10.1007/s10853-005-1205-7
[14] Babaevsky, P.G., Kozlov, N.A., Churilo, I.V. and Slagoda, V.V. (2005) Influence of Simulated and Natural Space Environment Factors on Dielectric Properties of Epoxyamine Polymers and Polymer-Based Composite Materials. Cosmic Research, 43, 25-33.
[15] Tanaka, T. (2005) Dielectric Nanocomposites with Insulating Properties. IEEE Transactions on Dielectrics and Electrical Insulation, 12, 914-928.
http://dx.doi.org/10.1109/TDEI.2005.1522186
[16] Singha, S. and Thomas, M.J. (2008) Permittivity and Tan Delta Characteristics of Epoxy Nanocomposites in the Frequency Range of 1 MHz-1 GHz. IEEE Transactions on Dielectrics and Electrical Insulation, 15, 2-11.
http://dx.doi.org/10.1109/T-DEI.2008.4446731
[17] Singh, V., Kulkarni, A.R. and Ramamohan, T.R. (2003) Dielectric Properties of Aluminum-Epoxy Composites. Journal of Applied Polymer Science, 90, 3602-3608.
http://dx.doi.org/10.1002/app.13085
[18] Kim, C.H. and Shin, J.S. (2002) Dielectric Relaxation of Siloxan-Epoxy Copolymers. Bulletin of the Korean Chemical Society, 23, 413-416.
[19] Ramajo, L., Catro, M.S. and Reboredo, M.M. (2007) Effect of Silane as Coupling Agent on the Dielectric Properties of BaTiO3-Epoxy Composites. Composites Part A: Applied Science and Manufacturing, 38, 1852-1959.
http://dx.doi.org/10.1016/j.compositesa.2007.04.003
[20] Hyun, J.G., Lee, S. and Paik, K.W. (2005) Frequency and Temperature Dependance of Dielectric Constant of Epoxy/ BaTiO3 Composite. Electronic Component and Technology Conference, 1241-1247.
[21] Muhammed, A., Athar, J. and Tasneem, Z.R. (2005) Dielectric Properties of Industrial Polymer Composite Materials. Turkish Journal of Physics, 29, 355-362.
[22] Hadik, N., Outzourhit, A., Elmansouri, A., Abouelaoualim, A., Oueriagli, A. and Ameziane, E.L. (2009) Dielectric Behavior of Ceramic (BST)/Epoxy Thick Films. Active and Passive Electronic Components, 2009, Article ID: 437130.
[23] Saq’an, S.A., Ayesh, A.S., Zihlif, A.M., Martuscelli, E. and Ragosta, G. (2004) Physical Properties of Polystyrene/Alum Composites. Polymer Testing, 23, 739-745.
http://dx.doi.org/10.1016/j.polymertesting.2004.04.008
[24] Cheng, K.-C., Lin, C.-M., Wang, S.-F., Lin, S.-T. and Yang, C.-F. (2007) Dielectric Properties of Epoxy Resin-Barium Titanate Composites at High Frequency. Materials Letters, 61, 757-760.
http://dx.doi.org/10.1016/j.matlet.2006.05.061
[25] Medalia, A.I. (1986) Electrical Conduction in Carbon Black Composites. Rubber Chemistry and Technology, 59, 432-454.
http://dx.doi.org/10.5254/1.3538209
[26] Hussain, A.A. and Hussain, W.A. (2010) Dielectric Properties of Epoxy/BaTiO3 Composites. Journal of Basrah Researches (Sciences), 36, 1-7.