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 JEMAA  Vol.3 No.6 , June 2011
Simplified Model of a Layer of Interconnects under a Spiral Inductor
Abstract: An empirical effective medium approximation that provides a homogeneous equivalent for a layer of interconnects un-derneath a spiral inductor is presented. When used as part of a numerical 3D model of the inductor, this approach yields a faster simulation that uses less memory, yet still predicts the quality factor and inductance to within 1%. We expect this technique to find use in the electromagnetic modeling of System-on-Chip.
Cite this paper: nullS. Holik and T. Drysdale, "Simplified Model of a Layer of Interconnects under a Spiral Inductor," Journal of Electromagnetic Analysis and Applications, Vol. 3 No. 6, 2011, pp. 187-190. doi: 10.4236/jemaa.2011.36031.
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