J. Choi, M. Swaminathan, B. Beker and R. Master, “Modeling of Realistic On-Chip Power Grid Using FDTD method,” IEEE International Symposium Electromagnetic Compatibility, Vol. 1, 2002, pp. 238-243.
 S. M. Holik and T. D. Drysdale, “Effective Medium Approximation for Electromagnetic Compatibility Analysis of Integrated Circuits,” Proceedings 2nd International Congress on Advanced Electromagnetic Materials in Microwaves and Optics, 2008, pp. 413-415.
 S. M. Holik and T. D. Drysdale, “Simplified Model for On-Chip Interconnects in Electromagnetic Modelling of System-in-Package,” Proceedings 12th International Conference on Electromagnetics in Advanced Applications, 2010, pp. 541-544.
 J. H. Chang, Y. S. Youn, H. K. Yu, and C. K. Kim, “Effects of dummy patterns and substrate on spiral inductors for sub-micron RF ICs,” IEEE Radio Frequency Integrated Circuits Symposium, 2-4 June 2002, pp. 419-422. doi:10.1109/RFIC.2002.1012081
 Ansoft High Frequency Structure Simulator (HFSS), 2010, http://www.ansoft.com/
 M. Park, S. Lee, C. S. Kim, K. H. Yu and K. S. Nam, “The Detailed Analysis of High Q CMOS-Compatible Microwave Spiral Inductors in Silicon Technology,” IEEE Transaction Electron Devices, Vol. 45, No. 9, 1998, pp. 1953-1959. doi:10.1109/16.711361