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 JECTC  Vol.4 No.4 , December 2014
A Loop Thermosyphon Type Cooling System for High Heat Flux
Abstract: With rapid development of the semiconductor technology, more efficient cooling systems for electronic devices are needed. In this situation, in the present study, a loop thermosyphon type cooling system, which is composed mainly of a heating block, an evaporator and an air-cooled condenser, is investigated experimentally in order to evaluate the cooling performance. At first, it is examined that the optimum volume filling rate of this cooling system is approximately 40%. Next, four kinds of working fluids, R1234ze(E), R1234ze(Z), R134a and ethanol, are tested using a blasted heat transfer surface of the evaporator. In cases of R1234ze(E), R1234ze(Z), R134a and ethanol, the effective heat flux, at which the heating block surface temperature reaches 70°C, is 116 W/cm2, 106 W/cm2, 104 W/cm2 and 60 W/cm2, respectively. This result indicates that R1234ze(E) is the most suitable for the present cooling system. The minimum boiling thermal resistance of R1234ze(E) is 0.05 (cm2·K)/W around the effective heat flux of 100 W/cm2. Finally, four kinds of heat transfer surfaces of the evaporator, smooth, blasted, copper-plated and finned surfaces, are tested using R1234ze(E) as working fluid. The boiling thermal resistance of the blasted surface is the smallest among tested heat transfer surfaces up to 116 W/cm2 in effective heat flux. However, it increases drastically due to the appearance of dry-patch if the effective heat flux exceeds 116 W/cm2. On the other hand, in cases of copper-plated and finned surfaces, the dry-patch does not appear up to 150 W/cm2 in effective heat flux, and the boiling thermal resistances of those surfaces keep 0.1 (cm2·K)/W.
Cite this paper: Yeo, J. , Yamashita, S. , Hayashida, M. , Koyama, S. (2014) A Loop Thermosyphon Type Cooling System for High Heat Flux. Journal of Electronics Cooling and Thermal Control, 4, 128-137. doi: 10.4236/jectc.2014.44014.
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