Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array
ABSTRACT
Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-array with water flow in this study, which had been reported to have a self-induced flip-flop flow phenomenon. Although the flip-flop flow phenomenon occurred in calculations, it was not observed in experiments. The heat transfer and pressure drop of the diamond-shaped fin-array could be estimated with equations for turbulent flow in tubes.
Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-array with water flow in this study, which had been reported to have a self-induced flip-flop flow phenomenon. Although the flip-flop flow phenomenon occurred in calculations, it was not observed in experiments. The heat transfer and pressure drop of the diamond-shaped fin-array could be estimated with equations for turbulent flow in tubes.
Cite this paper
Hirasawa, S. , Fujiwara, A. , Kawanami, T. and Shirai, K. (2014) Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array. Journal of Electronics Cooling and Thermal Control, 4, 78-85. doi: 10.4236/jectc.2014.43009.
Hirasawa, S. , Fujiwara, A. , Kawanami, T. and Shirai, K. (2014) Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array. Journal of Electronics Cooling and Thermal Control, 4, 78-85. doi: 10.4236/jectc.2014.43009.
References
[1] Nakazato, N., Hirasawa, S. and Mato, T. (1998) Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment. IEICE Transactions on Electronics, 81, 421-426. [2] Toyoda, H. and Kondo, Y. (2013) Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon. Journal of Electronics Cooling and Thermal Control, 3, 131-135.
http://dx.doi.org/10.4236/jectc.2013.34014 [3] Atarashi, T., Tanaka, T., Tsubaki, S. and Hirasawa, S. (2014) Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Lows of Memory Cards. Journal of Electronics Cooling and Thermal Control, 4, (Accepted to Be Published). [4] Tsuzuki, N., Utamura, M. and Ngo, T.L. (2009) Nusselt Number Correlations for a Microchannel Heat Exchanger Hot Water Supplier with S-Shaped Fins. Applied Thermal Engineering, 29, 3299-3308.
http://dx.doi.org/10.1016/j.applthermaleng.2009.05.004 [5] Tanda, G. (2001) Heat Transfer and Pressure Drop in a Rectangular Channel with Diamond-Shaped Elements. International Journal of Heat and Mass Transfer, 44, 3529-3541.
http://dx.doi.org/10.1016/S0017-9310(01)00018-7 [6] Umeda, S., Hasegawa, S. and Yang, W.J. (2005) Occurrence of Flip-Flop Flows in Diamond-Shaped Cylinder Bundles. Transaction of JSME B, 71, 2949-2955. [7] Umeda, S. and Yang, W.J. (2004) Effects of Mesh-Induced Upstream Turbulence on Flip-Flop Flow inside Diamond-Shaped Cylinder Bundles. Proceedings of ASMEHT-FED 2004 Conference, HT-FED2004-56140. [8] STAR-CCM+ Product Information (CD-Adapco Co.).
http://www.cd-adapco.com/products/STAR-CCM_plus/index.html [9] Holman, J.P. (1989) Heat Transfer. McGraw-Hill Book Co., New York.
[1] Nakazato, N., Hirasawa, S. and Mato, T. (1998) Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment. IEICE Transactions on Electronics, 81, 421-426. [2] Toyoda, H. and Kondo, Y. (2013) Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon. Journal of Electronics Cooling and Thermal Control, 3, 131-135.
http://dx.doi.org/10.4236/jectc.2013.34014 [3] Atarashi, T., Tanaka, T., Tsubaki, S. and Hirasawa, S. (2014) Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Lows of Memory Cards. Journal of Electronics Cooling and Thermal Control, 4, (Accepted to Be Published). [4] Tsuzuki, N., Utamura, M. and Ngo, T.L. (2009) Nusselt Number Correlations for a Microchannel Heat Exchanger Hot Water Supplier with S-Shaped Fins. Applied Thermal Engineering, 29, 3299-3308.
http://dx.doi.org/10.1016/j.applthermaleng.2009.05.004 [5] Tanda, G. (2001) Heat Transfer and Pressure Drop in a Rectangular Channel with Diamond-Shaped Elements. International Journal of Heat and Mass Transfer, 44, 3529-3541.
http://dx.doi.org/10.1016/S0017-9310(01)00018-7 [6] Umeda, S., Hasegawa, S. and Yang, W.J. (2005) Occurrence of Flip-Flop Flows in Diamond-Shaped Cylinder Bundles. Transaction of JSME B, 71, 2949-2955. [7] Umeda, S. and Yang, W.J. (2004) Effects of Mesh-Induced Upstream Turbulence on Flip-Flop Flow inside Diamond-Shaped Cylinder Bundles. Proceedings of ASMEHT-FED 2004 Conference, HT-FED2004-56140. [8] STAR-CCM+ Product Information (CD-Adapco Co.).
http://www.cd-adapco.com/products/STAR-CCM_plus/index.html [9] Holman, J.P. (1989) Heat Transfer. McGraw-Hill Book Co., New York.