[1] Nakazato, N., Hirasawa, S. and Mato, T. (1998) Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment. IEICE Transactions on Electronics, 3, 421-426.
[2] Toyoda, H. and Kondo, Y. (2013) Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon. Journal of Electronics Cooling and Thermal Control, 3, 131-135.
http://dx.doi.org/10.4236/jectc.2013.34014
[3] Yanagida, T. (1988) A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board. Transactions of JSME, Series B, 54, 1730-1735.
[4] Atarashi, T., Hatada, T. and Daikoku, T. (1994) Forced Air Cooling Radiators for Electronic Equipment. Transactions of JSME, Series B, 60, 620-626.
[5] Atarashi, T., Tanaka, T. and Tsubaki, S. (2012) Optimization of Heat Sinks with Plate Fins in Air-Jet Cooling. Proceedings of 3rd International Forum on Heat Transfer (IFHT2012), Paper No. 150.
[6] Kheirandish, Z., Nassab, S.A.G. and Vakilian, M. (2013) Second Law Analysis of Forced Convective Cooling in a Channel with a Heated Wall Mounted Obstacle. Journal of Electronics Cooling and Thermal Control, 3, 101-110.
http://dx.doi.org/10.4236/jectc.2013.33012
[7] Nakayama, W. (2014) Max Jakob Award Paper—Heat in Computers: Applied Heat Transfer in Information Technology. Transaction of ASME, Journal of Heat Transfer, 136, Article ID: 013001.
[8] Yoneda, N., Arita, J. and Hosokawa, K. (1999) Thermal Analysis of Memory Module. Proceedings of JSME Thermal Engineering Conference, 31-32.
[9] Holman, J.P. (1981) Heat Transfer (International Student Edition). McGraw Hill International Book Co.