Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards
Affiliation(s)
Hitachi, Ltd., Infrastructure Systems Company, Toshima, Tokyo, Japan. Hitachi, Ltd., Information and Telecommunication Systems Company, Hatano, Japan. Department of Mechanical Engineering, Kobe University, Kobe, Japan.
Hitachi, Ltd., Infrastructure Systems Company, Toshima, Tokyo, Japan. Hitachi, Ltd., Information and Telecommunication Systems Company, Hatano, Japan. Department of Mechanical Engineering, Kobe University, Kobe, Japan.
ABSTRACT
Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstream devices decreases the cooling capa-bility for the downstream devices. In this study we made an experimental apparatus including a memory card array and measured the effect of the rise in temperature of the air on the heat transfer coefficient of the memory cards that were downstream in the air flow. Using these mea-surements, we devised a simple calculation model, called the thermal diffusion layer model, to calculate the heat transfer coefficient of multiple rows of memory cards. The rise in temperature of downstream memory cards due to higher temperature air can be evaluated with a parameter representing the delay of thermal mixing for air. The heat transfer coefficient calculated with the thermal diffusion layer model agreed with our experimental results.
Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstream devices decreases the cooling capa-bility for the downstream devices. In this study we made an experimental apparatus including a memory card array and measured the effect of the rise in temperature of the air on the heat transfer coefficient of the memory cards that were downstream in the air flow. Using these mea-surements, we devised a simple calculation model, called the thermal diffusion layer model, to calculate the heat transfer coefficient of multiple rows of memory cards. The rise in temperature of downstream memory cards due to higher temperature air can be evaluated with a parameter representing the delay of thermal mixing for air. The heat transfer coefficient calculated with the thermal diffusion layer model agreed with our experimental results.
Cite this paper
Atarashi, T. , Tanaka, T. , Tsubaki, S. and Hirasawa, S. (2014) Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards. Journal of Electronics Cooling and Thermal Control, 4, 70-77. doi: 10.4236/jectc.2014.43008.
Atarashi, T. , Tanaka, T. , Tsubaki, S. and Hirasawa, S. (2014) Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards. Journal of Electronics Cooling and Thermal Control, 4, 70-77. doi: 10.4236/jectc.2014.43008.
References
[1] Nakazato, N., Hirasawa, S. and Mato, T. (1998) Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment. IEICE Transactions on Electronics, 3, 421-426. [2] Toyoda, H. and Kondo, Y. (2013) Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon. Journal of Electronics Cooling and Thermal Control, 3, 131-135.
http://dx.doi.org/10.4236/jectc.2013.34014 [3] Yanagida, T. (1988) A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board. Transactions of JSME, Series B, 54, 1730-1735. [4] Atarashi, T., Hatada, T. and Daikoku, T. (1994) Forced Air Cooling Radiators for Electronic Equipment. Transactions of JSME, Series B, 60, 620-626. [5] Atarashi, T., Tanaka, T. and Tsubaki, S. (2012) Optimization of Heat Sinks with Plate Fins in Air-Jet Cooling. Proceedings of 3rd International Forum on Heat Transfer (IFHT2012), Paper No. 150. [6] Kheirandish, Z., Nassab, S.A.G. and Vakilian, M. (2013) Second Law Analysis of Forced Convective Cooling in a Channel with a Heated Wall Mounted Obstacle. Journal of Electronics Cooling and Thermal Control, 3, 101-110.
http://dx.doi.org/10.4236/jectc.2013.33012 [7] Nakayama, W. (2014) Max Jakob Award Paper—Heat in Computers: Applied Heat Transfer in Information Technology. Transaction of ASME, Journal of Heat Transfer, 136, Article ID: 013001. [8] Yoneda, N., Arita, J. and Hosokawa, K. (1999) Thermal Analysis of Memory Module. Proceedings of JSME Thermal Engineering Conference, 31-32. [9] Holman, J.P. (1981) Heat Transfer (International Student Edition). McGraw Hill International Book Co.
[1] Nakazato, N., Hirasawa, S. and Mato, T. (1998) Natural Convection Cooling in Vertical Finned Plates in a Cabinet for Communication Equipment. IEICE Transactions on Electronics, 3, 421-426. [2] Toyoda, H. and Kondo, Y. (2013) Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon. Journal of Electronics Cooling and Thermal Control, 3, 131-135.
http://dx.doi.org/10.4236/jectc.2013.34014 [3] Yanagida, T. (1988) A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board. Transactions of JSME, Series B, 54, 1730-1735. [4] Atarashi, T., Hatada, T. and Daikoku, T. (1994) Forced Air Cooling Radiators for Electronic Equipment. Transactions of JSME, Series B, 60, 620-626. [5] Atarashi, T., Tanaka, T. and Tsubaki, S. (2012) Optimization of Heat Sinks with Plate Fins in Air-Jet Cooling. Proceedings of 3rd International Forum on Heat Transfer (IFHT2012), Paper No. 150. [6] Kheirandish, Z., Nassab, S.A.G. and Vakilian, M. (2013) Second Law Analysis of Forced Convective Cooling in a Channel with a Heated Wall Mounted Obstacle. Journal of Electronics Cooling and Thermal Control, 3, 101-110.
http://dx.doi.org/10.4236/jectc.2013.33012 [7] Nakayama, W. (2014) Max Jakob Award Paper—Heat in Computers: Applied Heat Transfer in Information Technology. Transaction of ASME, Journal of Heat Transfer, 136, Article ID: 013001. [8] Yoneda, N., Arita, J. and Hosokawa, K. (1999) Thermal Analysis of Memory Module. Proceedings of JSME Thermal Engineering Conference, 31-32. [9] Holman, J.P. (1981) Heat Transfer (International Student Edition). McGraw Hill International Book Co.