Numerical Simulation of Shock Resistant Microsystems (MEMS)
Affiliation(s)
Institute of Electronic Engineering, CAEP, Mianyang, China; Ministry of Education Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Mianyang, China. Institute of Electronic Engineering, CAEP, Mianyang, China.
Institute of Electronic Engineering, CAEP, Mianyang, China; Ministry of Education Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Mianyang, China. Institute of Electronic Engineering, CAEP, Mianyang, China.
ABSTRACT
The mechanical response of
shock-loaded microelectromechanical systems (MEMS) is simulated to formulate guidelines
for the design of dynamically reliable MEMS. MEMS are modeled as microstructures
supported on elastic substrates, and the shock loads are represented as pulses
of acceleration applied by the package on the substrate over a finite time
duration. For typical MEMS and shock loads, the response of the substrate is
closely approximated by rigid-body motion. Results indicate that modeling the shock
force as a quasi-static force for MEMS with low-natural frequencies may lead to
erroneous results. A criterion is obtained to distinguish between the dynamic and
quasi-static responses of the MEMS.
Cite this paper
Lu, Y. , Cheng, Y. and Sun, Y. (2014) Numerical Simulation of Shock Resistant Microsystems (MEMS). Modern Mechanical Engineering, 4, 119-124. doi: 10.4236/mme.2014.43011.
Lu, Y. , Cheng, Y. and Sun, Y. (2014) Numerical Simulation of Shock Resistant Microsystems (MEMS). Modern Mechanical Engineering, 4, 119-124. doi: 10.4236/mme.2014.43011.
References
[1] Srikar, V.T. and Senturia, S.D. (2002) The Reliability of Microelectromechanical Systems (MEMS) in Shock Environments. Journal of Microelectromechanical Systems, 11, 206-214.
http://dx.doi.org/10.1109/JMEMS.2002.1007399 [2] Tanner, D.M., Walraven, J.A., Helgesen, K., Irwin, L.W., Brown, F., Smith, N.F. and Masters, N. (2000) MEMS Reliability in Shock Environments. IEEE International Reliability Physics Symposium, San Jose, 10-13 April 2000, 129138. [3] Wagner, U., Franz, J., Schweiker, M., Bernhard, W. and Müller-Fiedler, R. (2001) Mechanical Reliability of MEMSStructures under Shock Load. Microelctronics Reliability, 41, 1657-1662.
http://dx.doi.org/10.1016/S0026-2714(01)00173-1 [4] Younis, M.I., Jordy, D. and Pitarresi, J.M. (2007) Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures under Mechanical Shock. Journal of Microelectromechanical Systems, 16, 628-638.
http://dx.doi.org/10.1109/JMEMS.2007.896701 [5] Li, G.X. and Shemansky Jr., F.A. (2000) Drop Test and Analysis on Micro-Machined Structures. Sensors and Actuators, 85, 280-286.
http://dx.doi.org/10.1016/S0924-4247(00)00427-1 [6] Tang, J., Zhao, R., Shi, Y.B. and Liu, J. (2012) Failure Analysis of the MEMS Ultra High Measure Range Accelerometer Structure under High Impact Environment. Chinese Journal of Sensors and Actuators, 25, 483-486. [7] Srikar, V.T. and Senturia, S.D. (2001) The Design and Analysis of Shock Resistant Microsystems (MEMS). The 11th International Conference on Solid-State Sensors and Actuators, Munich, 10-14 June 2001. [8] Senturia, S.D. (2001) Microsystem Design. Kluwer, Norwell. [9] Sun, Y.C., Yang, B., Peng, B., Zhao, L. and Zhang, Q.M. (2006) A Failure Mode of Micro Mechanical Shock Sensors. Chinese Journal of Sensors and Actuators, 19, 1610-1612. [10] Jiang, Y.Q., Du, M.H., Huang, W.D., Xu, W. and Luo, L. (2003) Simulation on the Encapsulation Effect of the High-g Shock MEMS Accelerometer. Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, 28-30 October 2003, 52-55. [11] Lu, Y.B., Cheng, Y.S. and Sun, Y.C. (2013) Numerical Analysis on the Deceleration Characteristics of Flat-End Steel Projectiles Penetrating Steel Plates. Journal of Sichuan Ordnance, 35, 1-5.
[1] Srikar, V.T. and Senturia, S.D. (2002) The Reliability of Microelectromechanical Systems (MEMS) in Shock Environments. Journal of Microelectromechanical Systems, 11, 206-214.
http://dx.doi.org/10.1109/JMEMS.2002.1007399 [2] Tanner, D.M., Walraven, J.A., Helgesen, K., Irwin, L.W., Brown, F., Smith, N.F. and Masters, N. (2000) MEMS Reliability in Shock Environments. IEEE International Reliability Physics Symposium, San Jose, 10-13 April 2000, 129138. [3] Wagner, U., Franz, J., Schweiker, M., Bernhard, W. and Müller-Fiedler, R. (2001) Mechanical Reliability of MEMSStructures under Shock Load. Microelctronics Reliability, 41, 1657-1662.
http://dx.doi.org/10.1016/S0026-2714(01)00173-1 [4] Younis, M.I., Jordy, D. and Pitarresi, J.M. (2007) Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures under Mechanical Shock. Journal of Microelectromechanical Systems, 16, 628-638.
http://dx.doi.org/10.1109/JMEMS.2007.896701 [5] Li, G.X. and Shemansky Jr., F.A. (2000) Drop Test and Analysis on Micro-Machined Structures. Sensors and Actuators, 85, 280-286.
http://dx.doi.org/10.1016/S0924-4247(00)00427-1 [6] Tang, J., Zhao, R., Shi, Y.B. and Liu, J. (2012) Failure Analysis of the MEMS Ultra High Measure Range Accelerometer Structure under High Impact Environment. Chinese Journal of Sensors and Actuators, 25, 483-486. [7] Srikar, V.T. and Senturia, S.D. (2001) The Design and Analysis of Shock Resistant Microsystems (MEMS). The 11th International Conference on Solid-State Sensors and Actuators, Munich, 10-14 June 2001. [8] Senturia, S.D. (2001) Microsystem Design. Kluwer, Norwell. [9] Sun, Y.C., Yang, B., Peng, B., Zhao, L. and Zhang, Q.M. (2006) A Failure Mode of Micro Mechanical Shock Sensors. Chinese Journal of Sensors and Actuators, 19, 1610-1612. [10] Jiang, Y.Q., Du, M.H., Huang, W.D., Xu, W. and Luo, L. (2003) Simulation on the Encapsulation Effect of the High-g Shock MEMS Accelerometer. Fifth International Conference on Electronic Packaging Technology Proceedings, Shanghai, 28-30 October 2003, 52-55. [11] Lu, Y.B., Cheng, Y.S. and Sun, Y.C. (2013) Numerical Analysis on the Deceleration Characteristics of Flat-End Steel Projectiles Penetrating Steel Plates. Journal of Sichuan Ordnance, 35, 1-5.