By means of
electroless copper deposition method a complex image has been fabricated in a
mixture of cupric sulphate and formaldehyde, the surface and subsurface
properties of which has been studied in detail by X-ray
photoelectron spectroscopy (XPS) combined with sputter depth profiling
technique analyzing distribution and chemical state of copper and silver.
Depth profiling by XPS in conjunction with Ar+ sputtering shows that
the catalytic activity of silver persists, catalyzing reduction of copper. The
integral areas of spectra Ag3d after electroless copper deposition for 5 min at
different sputtering times demonstrate that the amount of silver at the surface
is greater than that in the interior. And then, the quite likely reasonable
explanations are provided for the result. Additionally, the chemical shift of
Ag3d XPS and deconvolution of Ag3d XPS spectrum have been also analyzed
respectively at length.
Cite this paper
Zhang, Y. , Li, X. and Yang, Z. (2014) The Chemical State of a Silver-Copper Complex Image Formed during the Electroless Copper Deposition. Natural Science
, 852-858. doi: 10.4236/ns.2014.611082
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