Back
 JMP  Vol.5 No.8 , May 2014
Numerical Calculations of Some Plasma Parameters of the Capacitively Coupled RF Discharge
Mohamed Ali Hassouba, Ahmed Rida Galaly*, Usama Mohamed Rashed
Show more
Abstract: Numerical calculations by using a self-consistent model of the collisional sheath for the capacitively coupled RF discharge are our target. The results indicated that, at high pressure, the ohmic heating is usually the dominant heating mechanism in the discharge. The power dissipated in the sheath is calculated and compared with the measured data. Moreover, we indicated that, when the gas pressure is increased, the calculated dissipated power is decreased also while the measured input RF power is increased. Furthermore the sheath thickness of the capacitively coupled discharge is calculated and in the same order of the electron oscillation amplitude in the RF field, while the ionization mean free path is shorter than it.
Keywords: RF-Discharge, Self-Consistent Model, Ohmic Heating
Cite this paper: Hassouba, M. , Galaly, A. and Rashed, U. (2014) Numerical Calculations of Some Plasma Parameters of the Capacitively Coupled RF Discharge. Journal of Modern Physics, 5, 591-598. doi: 10.4236/jmp.2014.58070.
References

[1]   Galaly, A.R. and El Akshar, F.F. (2013) International Journal of Multidisciplinary Research and Advances in Engineering (IJMRAE), 5, 169-179.

[2]   Galaly, A.R., Elakshar, F.F. and Khedr, M.A. (2013) Materials Science Forum, 756, 143-150. http://dx.doi.org/10.4028/www.scientific.net/MSF.756.143

[3]   Galaly, A.R. and Elakshar, F.F. (2013) Journal of Modern Physics, 4, 215-225. http://dx.doi.org/10.4236/jmp.2013.42030

[4]   Hassouba, M.A., Nossair, A.M. and El-Akashar, F.F. (2001) Jurnal Fizik Malaysia, 22, 1.

[5]   Lisovskiy, V.A. and Yegorenkov, V.D. (2004) Vacuum, 74, 19-28. http://www.sciencedirect.com/science/journal/0042207X/74/1 http://dx.doi.org/10.1016/j.vacuum.2003.11.003

[6]   Chen, F.F. (2006) Plasma Sources Science and Technology, 15, 773. http://dx.doi.org/10.1088/0963-0252/15/4/022

[7]   Chen, F.F. (2009) Plasma Sources Science and Technology, 18, Article ID: 035012. http://dx.doi.org/10.1088/0963-0252/18/3/035012

[8]   Amanatides, E. and Mataras, D. (2001) Journal of Applied Physics, 89, 1556. http://dx.doi.org/10.1063/1.1337597

[9]   Dudnikov, V. and Dudnikov, A. (2012) Review of Scientific Instruments, 83, Article ID: 02A720.

[10]   Godyak, V.A., Piejak, R.B. and Alexandrovich, B.M. (1991) IEEE Transactions on Plasma Science, 19, 134.

[11]   Liebermann, M.A. (1989) Journal of Applied Physics, 65, 4168. http://dx.doi.org/10.1063/1.343298

[12]   Godyak, V.A. (1990) IEEE Transactions on Plasma Science, 18 159-168. http://dx.doi.org/10.1109/27.45519

[13]   Liebermann, M.A. and Lichtenberg, A.J. (1994) Principles of Plasma Discharges and Materials Processes. John Wiley & Sons Inc., New York.

[14]   Allen, J.A., Boyd, R.L. and Reynolds, P. (1957) Proceedings of the Physical Society B, 70, 297. http://dx.doi.org/10.1088/0370-1301/70/3/303

[15]   Surendra, M. and Graves, D.B. (1990) Applied Physics Letters, 56, 1022. http://dx.doi.org/10.1063/1.102604

[16]   Spiliopoulos, N., Mataras, D. and Rapakoulias, D.E. (1996) Journal of Vacuum Science & Technology A, 14, 2757. http://dx.doi.org/10.1116/1.580197

 
 
Top