ENG  Vol.3 No.4 , April 2011
Investigations on Non-Condensation Gas of a Heat Pipe
Abstract: This paper utilizes numerical analysis method to determine the influence of non-condensation gas on the thermal performance of a heat pipe. The temperature difference between the evaporation and condensation sections of a single heat pipe and maximum heat capacity are the index of the thermal performance of a heat pipe for a thermal module manufacturer. The thermal performance of a heat pipe with lower temperature difference between the evaporation and condensation sections is better than that of higher temperature dif- ference at the same input power. The results show that the maximum heat capacity reaches the highest point, as the amount of the non-condensation gas of a heat pipe is the lowest value and the temperature difference between evaporation and condensation sections is the smallest one. The temperature difference is under 1?C while the percentage of the non-condensation gas is under 8 × 10?5%, and the heat pipe has the maximum heat capacity.
Cite this paper: nullJ. Wang, "Investigations on Non-Condensation Gas of a Heat Pipe," Engineering, Vol. 3 No. 4, 2011, pp. 376-383. doi: 10.4236/eng.2011.34043.

[1]   G. M. Grover, “US Patent No. 3229759,” 1963.

[2]   G. P. Peterson, “An Introduction to Heat Pipe—Mode- ling, Testing, and Applications,” John Wiley & Sons Inc., New York, 1994.

[3]   Y. Wang and G. P. Peterson, “Investi-gation of a Novel Flat Heat Pipe,” Journal of Heat Transfer, Vol. 127, No. 2, 2005, pp. 165-170. UUU-doi:10.1115/1.1842789UUU

[4]   A. Faghri, “Heat Pipe Science and Technology,” Taylor and Francis Ltd., Washington DC, 1995.

[5]   V. G. Rajesha and K. P. Ra-vindrana, “Optimum Heat Pipe Design: A Nonlinear Pro-gramming Approach,” International Communications in Heat and Mass Transfer, Vol. 24, No. 3, 1997, pp. 371-380. UUUdoi:10.1016/S0735-1933(97)00022-5UUU

[6]   F. Lefevre and M. Lallemand, “Coupled Thermal and Hy-drodynamic Models of Flat Micro Heat Pipes for the Cooling of Multiple Electronic Components,” Interna-tional Journal of Heat and Mass Transfer, Vol. 49, No. 7-8, 2006, pp. 1375-1383. UUU-doi:10.1016/j.ijheatmasstransfer.2005.10.001UUU

[7]   G. P. Peterson and L. S. Fletcher, “Effective Thermal Conductivity of Sintered Heat Pipe Wicks,” Journal of Thermophysics, Vol. 1, No. 4, 1987, pp.343-347. UUUdoi:10.2514/3.50UUU

[8]   G. Mohamed, L. M. Hung and J. M. Tournier, “Transient Experiments of an Inclined Copper Water Heat Pipe,” Journal of Thermo-physics and Heat Transfer, Vol. 9, No. 1, 1995, pp.109-116.

[9]   X. L. Xie, Y. L. He, W. Q Tao and H. W. Yang, “An Experimental Investigation on a Novel High-Performance Integrated Heat Pipe—Heat Sink for High-Flux Chip Cooling,” Applied Thermal Engineering, Vol. 28, 2008, pp. 433-439. UUU-doi:10.1016/j.applthermaleng.2007.05.010UUU

[10]   D. A. Beson and C. V. Robino, “Design and Testing of Metal and Silicon Heat Spreaders with Embedded Microma-chined Heat Pipes,” American Society of Mechanical En-gineers, Vol. 26, 1999, pp. 2-8.

[11]   N. J. Gernert, J. Toth and J. Hartenstine, “100 W/cm2 and Higher Heat Flux Dissipation Using Heat Pipes,” 13th In- ternational Heat Pipe Conference, 21-25 September 2004, Shanghai, pp. 256-262.

[12]   J.-C. Wang, “Superposition Method to Investigate the Thermal Performance of Heat Sink with Embedded Heat Pipes,” International Communication in Heat and Mass Transfer, Vol. 36, No. 7, 2009, pp. 686-692. UUU-doi:10.1016/j.icheatmasstransfer.2009.04.008UUU

[13]   J.-C. Wang, R.-T. Wang, C.-C. Chang and C.-L. Huang, “Program for Rapid Computation of the Thermal Perfor-mance of a Heat Sink with Embedded Heat Pipes,” Jour-nal of the Chinese Society of Mechanical Engineers, Vol. 31, No. 1, 2010, pp. 21-28.

[14]   J.-C. Wang, “L-Type Heat Pipes Application in Electronic Cooling System,” International Journal of Thermal Sciences, Vol. 50, No. 1, 2011, pp.97-105. UUUdoi:10.1016/j.ijthermalsci.2010.07.001UUU

[15]   W. H. Huang, “Fabrication and Performance Testing of Sintered Miniature Heat Pipe,” M. E. Master Thesis, National Taiwan University, Taiwan, 2000.

[16]   20 December 2010.