P. Enoksson, G. Stemme and E. Stemme, “A Silicon Resonant Sensor Structure for Coriolis Mass-Flow Measurements,” Journal of MEMS, Vol. 6, 1997, pp. 119-125.
 R. Smith, D. Sparks, D. Riley and N. Najafi, “A MEMS-Based Coriolis Mass Flow Sensor for Industrial Applications,” IEEE Transactions on Industrial Electronics, Vol. 56, No. 4, 2009, pp. 1066-1071.
 H. Toda and T. Kobayakawa, “High-Speed Gas Concentration Measurement Using Ultrasound,” Sensors and Actuators A, Vol. 144, 2008, pp. 1-6.
 D. Sparks R. Smith, J. Patel and N. Najafi, “A MEMS-Based Low Pressure, Light Gas Density and Binary Concentration Sensor,” Sensors & Actuators A, Vol. 171, 2011, pp. 159-162.
 J. Gragg, “Silicon Pressure Sensor,” US Patent 4317126, 1982.
 H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi and M. Esashi, “Vacuum Packaging for Microsensors by Glass-Silicon Anodic Bonding,” Sensors and Actuators A, Vol. 43, 1994, pp. 243-250.
 H. Elgamel, “Closed-Form Expressions for the Relationships between Stress, Diaphragm Deflection, and Resistance Change with Pressure in Silicon Piezoresistive Pressure Sensors,” Sensors and Actuators A, Vol. 50, 1995, pp. 17-12.
 W. Baney, D. Chilcott, X. Huang, S. Long, J. Siekkinen, D. Sparks and S. Staller, “A Comparison between Micro-machined Piezoresistive and Capacitive Pressure Sensors, Proceedings of the Fall SAE Conference, 1997, pp. 61- 66.
 B. Kim, R. Candler, R. Melamud, M. Hopcraft, S. Yoneoka, H. Lee, M. Agarwal, S. Chanorkar, G. Yama and T. Kenny, “Hermeticity and Diffusion Investigation in Poly-silicon Film Encapsulation for MEMS,” Journal of Applied Physics, Vol. 105, 2009, Article ID: 013514.
 D. Sparks, “The Hermeticity of Sealed Microstructures under Low Temperature Helium and Hydrogen Exposure,” Journal of Micromechanics and Microengineering, Vol. 23, 2013, Article ID: 015016.
 D. Sparks, K. Kawaguchi, M. Yasuda, D. Riley, V. Cruz, N. Tran, A. Chimbayo and N. Najafi, “Embedded MEMS- Based Concentration Sensor for Fuel Cell and Biofuel Applications,” Sensors and Actuators A, Vol. 145-146, 2008, pp. 9-13.
 J. Mitchell, G. Lahiji and K. Najafi, “An Improved Performance Poly-Si Pirani Vacuum Gauge Using Heat-Distributed Structural Supports,” Journal of MEMS, Vol. 17, 2008, pp. 93-102.
 J. Mitchell and K. Najafi, “A Detailed Study of Yield and Reliability for Vacuum Packages Fabricated in a Wafer-Level Au-Si Eutectic Bonding Process,” Denver, Trans- ducers, 2009, Article ID: T2E.004.
 D. Sparks, S. Massoud-Ansari and N. Najafi, “Long-Term Evaluation of Hermetically Glass Frit Sealed Silicon to Pyrex Wafers with Feedthroughs,” Journal of Microme- chanics and Microengineering, Vol. 15, 2005, pp. 1560-1564. http://dx.doi.org/10.1088/0960-1317/15/8/026
 H. Cady and D. McFarland, “Helium in Natural Gas,” Science, Vol. 24, 1906, pp. 344-347.
 S. García-Blanco, P. Topart, Y. Desroches, J. Caron, F. Williamson, C. Alain and H. Jerominek, “Low Temperature Hermetic Wafer-Level Package for Uncooled Microbolometer FPAs,” Proceedings of SPIE 6884, 2008, Article ID: 68840P-1.
 D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi and K. Jayakar, “Wafer-to-Wafer Bonding of Nonplanarized MEMS Surfaces Using Solder,” Journal of Micromechanics and Microengineering, Vol. 11, No. 6, 2011, pp. 630-634.
 J. Vinti, “The Dispersion and Absorption of Helium,” Physical Reviews, Vol. 42, 1932, pp. 632-640.
 R. Osiander and A. Darrin, “MEMS for Automotive and Aerospace Applications,” Woodhead Publishing, Oxford, 2013, p. 324.
 Y. Tao and A. Malsha, “Theoretical Investigation on Hermeticity Testing of MEMS Packages Based on MIL-STD-883E,” Microelectronics and Reliability, Vol. 45, 2005, pp. 559-566.
 T. Anthony, “Anodic Bonding of Imperfect Surfaces,” Journal of Applied Physics, Vol. 58, No. 5, 1983, pp. 2419-2424. http://dx.doi.org/10.1063/1.332357
 Q.-Y. Tong and U. G?sele, “Semiconductor Wafer Bonding: Science and Technology,” Wiley Interscience, New York, 1999.
 R. Swanson, “Electronic Pressure Transmitters: The Hydrogen Problem,” Sensors, Vol. 10, 1993, pp. 33-40.