R. Smith, D. Sparks, D. Riley and N. Najafi, “A MEMS-Based Coriolis Mass Flow Sensor for Industrial Applications,” IEEE Transactions on Industrial Electronics, Vol. 56, No. 4, 2009, pp. 1066-1071. http://dx.doi.org/10.1109/TIE.2008.926703
 D. Sparks R. Smith, J. Patel and N. Najafi, “A MEMS-Based Low Pressure, Light Gas Density and Binary Concentration Sensor,” Sensors & Actuators A, Vol. 171, 2011, pp. 159-162. http://dx.doi.org/10.1016/j.sna.2011.08.011
 H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi and M. Esashi, “Vacuum Packaging for Microsensors by Glass-Silicon Anodic Bonding,” Sensors and Actuators A, Vol. 43, 1994, pp. 243-250. http://dx.doi.org/10.1016/0924-4247(94)80003-0
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 W. Baney, D. Chilcott, X. Huang, S. Long, J. Siekkinen, D. Sparks and S. Staller, “A Comparison between Micro-machined Piezoresistive and Capacitive Pressure Sensors, Proceedings of the Fall SAE Conference, 1997, pp. 61- 66.
 B. Kim, R. Candler, R. Melamud, M. Hopcraft, S. Yoneoka, H. Lee, M. Agarwal, S. Chanorkar, G. Yama and T. Kenny, “Hermeticity and Diffusion Investigation in Poly-silicon Film Encapsulation for MEMS,” Journal of Applied Physics, Vol. 105, 2009, Article ID: 013514. http://dx.doi.org/10.1063/1.3054366
 D. Sparks, “The Hermeticity of Sealed Microstructures under Low Temperature Helium and Hydrogen Exposure,” Journal of Micromechanics and Microengineering, Vol. 23, 2013, Article ID: 015016. http://dx.doi.org/10.1088/0960-1317/23/1/015016
 D. Sparks, K. Kawaguchi, M. Yasuda, D. Riley, V. Cruz, N. Tran, A. Chimbayo and N. Najafi, “Embedded MEMS- Based Concentration Sensor for Fuel Cell and Biofuel Applications,” Sensors and Actuators A, Vol. 145-146, 2008, pp. 9-13. http://dx.doi.org/10.1016/j.sna.2007.10.015
 J. Mitchell, G. Lahiji and K. Najafi, “An Improved Performance Poly-Si Pirani Vacuum Gauge Using Heat-Distributed Structural Supports,” Journal of MEMS, Vol. 17, 2008, pp. 93-102. http://dx.doi.org/10.1109/JMEMS.2007.912711
 J. Mitchell and K. Najafi, “A Detailed Study of Yield and Reliability for Vacuum Packages Fabricated in a Wafer-Level Au-Si Eutectic Bonding Process,” Denver, Trans- ducers, 2009, Article ID: T2E.004.
 D. Sparks, S. Massoud-Ansari and N. Najafi, “Long-Term Evaluation of Hermetically Glass Frit Sealed Silicon to Pyrex Wafers with Feedthroughs,” Journal of Microme- chanics and Microengineering, Vol. 15, 2005, pp. 1560-1564. http://dx.doi.org/10.1088/0960-1317/15/8/026
 S. García-Blanco, P. Topart, Y. Desroches, J. Caron, F. Williamson, C. Alain and H. Jerominek, “Low Temperature Hermetic Wafer-Level Package for Uncooled Microbolometer FPAs,” Proceedings of SPIE 6884, 2008, Article ID: 68840P-1.
 D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi and K. Jayakar, “Wafer-to-Wafer Bonding of Nonplanarized MEMS Surfaces Using Solder,” Journal of Micromechanics and Microengineering, Vol. 11, No. 6, 2011, pp. 630-634. http://dx.doi.org/10.1088/0960-1317/11/6/303
 Y. Tao and A. Malsha, “Theoretical Investigation on Hermeticity Testing of MEMS Packages Based on MIL-STD-883E,” Microelectronics and Reliability, Vol. 45, 2005, pp. 559-566. http://dx.doi.org/10.1016/j.microrel.2004.08.004