Mechanical properties of electrodeposited and
electroless copper with nano- and crystalline structure are considered. Grain
diameters in films ranged from 0.06 to 8 μm. A model is described which takes
into account the grain boundary hardening and density of dislocation.
Cite this paper
Kosarev, N. , Khazin, M. , Apakashev, R. and Valiev, N. (2013) Mechanical Properties of Micro- and Nanostructured Copper Films. Journal of Materials Science and Chemical Engineering
, 7-10. doi: 10.4236/msce.2013.15002
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