In this paper, three-dimensional finite element analysis using the
commercial ANSYS software is performed to study the thermal performance of a
thermally enhanced FC-PBGA (flip-chip plastic ball grid array) assembly in both
natural and forced convection environments. The thermally enhanced FC-PBGA
assembly is a basic FC-PBGA assembly
with a lid attached on top, after which an extruded-fin heatsink
is attached on the top of the lid. The finite element model is complete enough
to include key elements such as bumps, solder balls, substrate, printed circuit board, extruded-fin
heatsink, lid, vias, TIM1 (thermal interface material 1), TIM2 (thermal
interface material 2), lid-substrate adhesive and ground planes for both signal
and power. Temperature fields are simulated and presented for several package configurations. Thermal resistance is calculated to
characterize and compare the thermal performance by considering alternative
design parameters of the polymer-based materials and the thermal enhancement
components. The polymer-based materials include underfill, TIM1, TIM2,
lid-substrate adhesive and substrate core material. The specific thermal enhancement
components are the extruded-fin heatsink
and the lid.
Cite this paper
Lin, C. , Wu, G. and Ju, S. (2013) Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly. Journal of Electronics Cooling and Thermal Control, 3, 85-93. doi: 10.4236/jectc.2013.33010.
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