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 OPJ  Vol.3 No.4 A , August 2013
The Effect of Laser Sintering Process Parameters on Cu Nanoparticle Ink in Room Conditions
Abstract: Copper is an interesting material for printed electronics inks because, for example, of its good conductivity and lower raw material price compared to silver. However, post-processing Cu inks is challenging because of non-conductive copper oxide. In this work, inkjet-printed Cu nanoparticle structures were sintered on a polyimide substrate with a continuous-wave 808-nm diode laser. Laser sintering was tested by varying the sintering parameters (optical power and scanning velocity), and the electrical resistance of the samples was measured. A minimum sheet resistance of approx.90 mΩ/□ was obtained. All tests were run in room conditions. Sintered structures were then analyzed from SEM images. Results showed that laser sintering produces good repeatability, that a scanning velocity increment positively affects the process window, and that multiple sintering cycles do not increase conductivity.
Cite this paper: E. Halonen, E. Heinonen and M. Mäntysalo, "The Effect of Laser Sintering Process Parameters on Cu Nanoparticle Ink in Room Conditions," Optics and Photonics Journal, Vol. 3 No. 4, 2013, pp. 40-44. doi: 10.4236/opj.2013.34A007.
References

[1]   S. E. Molesa, “Ultra-Low-Cost Printed Electronics,” Technical Report No.UCB/EECS-2006-55, Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, 2006.

[2]   M. A. M. Leenen, V. Arning, H. Thiem, J. Steiger and R. Anselmann, “Printable Electronics: Flexibility for the Future,” Physica Status Solidi (A), Vol. 206, No. 4, 2009, pp. 588-597. doi:10.1002/pssa.200824428

[3]   V. Pekkanen, K. Kaija, M. Mantysalo, E. Kunnari, J. Niittynen and P. Mansikkamaki, “Functional Fluid Jetting Performance Optimization,” Microelectronics Reliability, Vol. 50, No. 6, 2010, pp. 864-871. doi:10.1016/j.microrel.2010.02.002

[4]   D. Soltman and V. Subramanian, “Inkjet-Printed Line Morphologies and Temperature Control of the Coffee Ring Effect,” American Chemical Society, 2008.

[5]   D. Jang, D. kim and J. Moon, “Influence of Fluid Physical Properties on Ink-Jet Printability,” Langmuir, Vol. 25, No. 5, 2009, pp. 2629-2635. doi:10.1021/la900059m

[6]   E. Halonen, T. Viiru, K. Ostman, A. L. Cabezas and M. Mantysalo, “Oven Sintering Process Optimization for Inkjet-Printed Ag Nanoparticle Ink,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, No. 2, 2013, pp. 350-356. doi:10.1109/TCPMT.2012.2226458

[7]   J. R. Greer and R. A. Street, “Thermal Cure Effects on Electrical Performance of Nanoparticle Silver Inks,” Acta Materia, Vol. 55, No. 18, 2007, pp. 6345-6349.

[8]   M. Joo, B. Lee, S. Jeong and M. Lee, “Laser Sintering of Cu Paste Film Printed on Polyimide Substrate,” Applied Surface Science, Vol. 258, No. 1, 2011, pp. 521-524. doi:10.1016/j.apsusc.2011.08.076

[9]   M. Joo, B. Lee, S. Jeong and M. Lee, “Comparative Studies on Thermal and Laser Sintering for Highly Conductive Cu Films Printable on Plastic Substrate,” Thin Solid Films, Vol. 520, No. 7, 2012, pp. 2878-2883. doi:10.1016/j.tsf.2011.11.078

[10]   H.-S. Kim, S. R. Dhage, D.-E. Shim and H. T. Hahn, “Intense Pulsed Light Sintering of Copper Nanonink for Printed Electronics,” Applied Physics A—Materials Science and Processing, Vol. 97, No. 4, 2009, pp. 791-798. doi:10.1007/s00339-009-5360-6

[11]   J. Ryu, H.-S. Kim and H. T. Hahn, “Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics,” Journal of Electronic Matererials, Vol. 40, No. 1, 2011, pp. 42-50. doi:10.1007/s11664-010-1384-0

[12]   E. Halonen, S. Koskinen, I. Leino, P. Heljo and M. Mantysalo, “Sintering of Inkjet-Printed Cu-nanoparticle Ink in Ambient Conditions Using a Continuous Wave 808 nm Diode Laser,” MRS Proceedings, Vol. 1529, 2013.

[13]   T. Kumpulainen, J. Pekkanen, J. Valkama, J. Laakso, R. Tuokko and M. Mantysalo, “Low Temperature Nanoparticle Sintering with Continuous Wave and Pulse Lasers,” Optics and Laser Technology, Vol. 43, No. 3, 2011, pp. 570-576. doi:10.1016/j.optlastec.2010.08.002

[14]   Kapton HN Datasheet. http://www2.dupont.com/Kapton/en_US/assets/downloads/pdf/HN_datasheet.pdf

[15]   I. Reinhold, et al., “US Argon Plasma Sintering of Inkjet Printed Silver Tracks on Polymer Substrates,” Journal of Materials Chemistry, Vol. 19, No. 21, 2009, pp. 3384-3388. doi:10.1039/b823329b

 
 
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