[1] M. Carchia, “Electronic/Electrical Reliability,” Carnegie Mellon University, Pittsburgh, 1999.
[2] R. Remsburg, “Thermal Design of Electronic Equipment,” CRC Press, London, 2001.
[3] V. V. Vlassov, “Analytical Model of the Two-Dimensional Temperature Distribution over a Single Electronic Circuit Board,” Reterm—Thermal Engineering (Engenharia Térmica), Vol. 3, 2003, pp. 32-37.
[4] V. V. Vlassov, “A Tool for Thermal Analysis of Electronic Boards with Multiple Heat Sources and Sinks,” SAE Paper 2005-01-3058, 2005. http://www.sae.org/technical/papers/2005-01-3058
[5] J. R. Culham, P. Teertstra and M. M. Yovanovich, “The Role of Spreading Resistance on Effective Conductivity in Laminated Substrates,” Future Circuits, Vol. 6, 2000, pp. 73-78.