ENG  Vol.2 No.8 , August 2010
Wire Bonding Using Offline Programming Method
Abstract: Manual process of creating bonding diagram is known to be time consuming and error prone. In comparison, offline programming (OLP) provides a much more viable option to reduce the wire bonding creation time and error. OLP is available in two versions, i.e., vendor specific OLP and direct integration offline pro- gramming (Di-OLP). Both versions utilize the bonding diagram and computer aided design data to speed up bonding program creation. However, the newly proposed Di-OLP is more flexible as it can be used to create bonding program for multiple machine platforms in microelectronics industry. Some special features of Di-OLP method are presented. The application of generic OLP however, is applicable to machines that recognize ASCII text file. The user needs to know the data format accepted by machine and convert the data accordingly to suit its application for different machine platforms. Di-OLP is also a practical method to replace the time consuming manual method in production line.
Cite this paper: nullY. Foo, A. You and C. Chin, "Wire Bonding Using Offline Programming Method," Engineering, Vol. 2 No. 8, 2010, pp. 668-672. doi: 10.4236/eng.2010.28086.

[1]   S. Kalpakjian, “Manufacturing Engineering and Techno- logy,” 3rd Edition, Surface Technology, Kansas, 1995.

[2]   S. DiBartolomeo, “Advance Packaging,” Penn Well, Nashua, 2000.

[3]   R. R. Tummala, V. Sudaram, F. Liu, G. White, S. Bhattacharya, R. M. Pulugurtha, M. Swaminathan, J. Laskar, N. M. Jokerst and S. Y. Chow, “High Density Packaging in 2010 and Beyond,” IEEE International Symposium on Electronic Materials and Packaging, Taiwan, 2002, pp. 30-36.

[4]   L Nguyen, I. Singh, C. Murray, J. Jackson, J. DeRosa and D. Ho, “70 μm Fine Pitch Wire Bonding,” IEEE International Elec-tronics Manufacturing Technology Symposium, Adelaide, 1998, pp. 394-400.

[5]   T. C. Chang, R. A. Wysk and H. P. Wang, “Com- puter-Aided Manufacturing,” 3rd Edition, Prentice Hall, New York, 1998.

[6]   S. K. Prasad, “Advanced Wire Bond Interconnection,” Springer, Berlin, 2004.

[7]   C. J. Oh, Y. J. Lee, Y. J. Han and C. S. Ahn, “A New System for Reducing the Bonding Process Cycle Time and Increasing the Accuracy of Bonding Diagram,” IEEE International Conference on System, Man and Cyber- netics, Vol. 5, 2004, pp. 4301-4305.

[8]   Y. L. Foo, A. H. You and C. W. Chin, “Direct Integration Offline Programming Method in Wire Bonding Process,” 11th International Conference on Electronic Materials and Packaging, Taiwan, 2009, pp. 1-5.

[9]   G. G. Harman, “Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield,” 2nd Edition, McGraw-Hill, New York, 1997.