ABSTRACT To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26ºC. Results show that the temperature of the substrate of LEDs reaches 62ºC without the fan, however, it reaches only 32ºC when the best cooling condition appears. The temperature of the LEDs decreases by 30ºC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.
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nullR. Wang and J. Li, "A Cooling System with a Fan for Thermal Management of High-Power LEDs," Journal of Modern Physics, Vol. 1 No. 3, 2010, pp. 196-199. doi: 10.4236/jmp.2010.13029.
 W. H. Chi, T. L. Chou, C. N. Han and K. N. Chiang, “Analysis of Thermal Performance of High Power Light Emitting Diodes Package,” International Conference on Electronics Packaging Technology, Nanjing, 2008, pp. 533-538.
 X. Luo, W. Xiong and S. Liu, “A Simplified Thermal Resistance Network Model for High Power LED Street Lamp,” International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, 2008, pp. 1-7.
 B. Li, “Lumen Efficiency of 1 W-Level High Power White LED,” Semiconductor Optoelectronics, Vol. 26, No. 4, 2005, pp. 314-316.
 X. He, B. Cheng, L. Yin and J. Zhang, “Testing System for Thermal Resistance of High-Power LED,” Electronic Measuremient Technology, Vol. 31, No. 9, 2008, pp. 17-20.
 N. Holonyak, “Is the Light Emitting Diode (LED) an Ultimate Lamp?” American Journal of Physics, Vol. 68, No. 9, 2000, pp. 864-868.
 W. Dai, J. Wang and Y. Li, “Transient Thermal Analysis of High-power LED Package,” Semiconductor Optoelectronics, Vol. 29, No. 3, 2008, pp. 324-328.
 B. Yu and Y. Wang, “Junction Temperature and Thermal Resistance Restrict the Developing of High-power LED,” Chinese Journal of Luminescence, Vol. 26, No. 6, 2005, pp. 761-766.
 N. Narendran and Y. Gu, “Life of LED-Based White Light Source,” IEEE/OSA Journal of Display Technology, Vol. 1, No. 1, 2005, pp. 167-171.
 X. Luo and S. Liu, “A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs,” IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, 2007, pp. 475-484.
 K. Zhang, G. Xiao, C. Wong, H. Gu and B. Xu, “Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip Technology,” 55th Electronic Components and Technology Conference, Lake Buena Vista, 2005, pp. 60-65.
 L. Yuan, S. Liu, M. Chen and X. Luo, “Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler,” 7th International Conference on Electronic Packaging Technology (ICEPT '06), Shanghai, 2006, pp. 1-5.
 Y. Liu, G. Fu, C. Gao, X. Li and S. Wang, “Thermal Analysis of Illumination High-Power LED,” Chinese Journal of Electron Devices, Vol. 31, No. 6, 2008, pp. 1716-1719.
 S. Zhang, L. Fang, G. Fu, X. Tan, J. Dong, Y. Chen and L. Gao, “Effect of Thermal Conductive Coating on Thermolysis Property of LED,” Semiconductor Optoelectronics, Vol. 28, No. 6, 2007, pp. 793-796.