WJNSE  Vol.2 No.3 , September 2012
Low Temperature Formation of Silver and Silver-Copper Alloy Nano-Particles Using Plasma Enhanced Hydrogenation and Their Optical Properties
ABSTRACT
In this paper, a novel method of producing nanoparticles at low temperatures using hydrogen bombardment of thin films, deposited on glass substrates, is introduced. Silver nanoparticles were obtained by this method in our Plasma Enhanced Chemical Vapor Deposition system. Optical and morphological characteristics of these nanoparticles were extensively studied for various conditions of plasma treatment, such as plasma power density, temperature, duration of hydrogen bombardment, thickness of the initial thin metallic film etc. In addition, Ag-Cu alloy nanoparticles on glass substrates were also achieved. The process of nanoparticle formation in this method shows that several kinds of metals and semiconductors nanoparticles can be obtained using this approach. Scanning Electron Microscopy, Atomic Force Microscopy and Transmission Electron Microscopy were used to analyze the nanostructures.

Cite this paper
Z. Kiani, Y. Abdi and E. Arzi, "Low Temperature Formation of Silver and Silver-Copper Alloy Nano-Particles Using Plasma Enhanced Hydrogenation and Their Optical Properties," World Journal of Nano Science and Engineering, Vol. 2 No. 3, 2012, pp. 142-147. doi: 10.4236/wjnse.2012.23018.
References
[1]   W. H. Weber and G. W. Ford, “Propagation of Optical Excitations by Dipolar Interactions in Metal Nanoparticle Chains,” Physical Review B, Vol. 70, No. 12, 2004, pp. 125429.1-125429.8. doi:10.1103/PhysRevB.70.125429

[2]   S. Link and M. A. El-Sayed, “Spectral Properties and Relaxation Dynamics of Surface Plasmon Electronic Oscillations in Gold and Silver Nanodots and Nanorods,” The Journal of Physical Chemistry B, Vol. 103, No. 40, 1999, pp. 8410-8426. doi:10.1021/jp9917648

[3]   W. P. Zhou, A. Lewera, R. Larsen, R. I. Masel, P. S. Bagus and A. Wieckowski, “Size Effects in Electronic and Catalytic Properties of Unsupported Palladium Nanoparticles in Electrooxidation of Formic Acid,” The Journal of Physical Chemistry B, Vol. 110, No. 27, 2006, pp. 13393-13398. doi:10.1021/jp061690h

[4]   P. Waszczuk, T. M. Barnard, C. Rice, R. I. Masel and A. Wieckowski, “A Nanoparticle Catalyst with Superior Activity for Electrooxidation of Formic Acid,” Electro-chemistry Communications, Vol. 4, No. 7, 2003, pp. 599- 603. doi:10.1016/S1388-2481(02)00386-7

[5]   B. Choi and H.-H. Lee, “Characterization of the Optical Properties of Silver Nanoparticle Films,” Nanotechnology, Vol. 18, No. 7, 2007, p. 075706.

[6]   T. K. Sindhu, R. Sarathi and S. R. Chakravarthy, “Under- standing Nanoparticle Formation by a Wire Explosion Process through Experimental and Modeling Studies,” Nanotechnology, Vol. 19, No. 2, 2008, p. 025703.

[7]   S. H. Ko and Y. Choi, “Nanosecond Laser Ablation of Gold Nanoparticle Films,” Applied Physics Letters, Vol. 89, No. 14, 2006, p. 141126. doi:10.1063/1.2360241

[8]   M. Valden, X. Lai and D. W. Goodman, “Onset of Catalytic Activity of Gold Clusters on Titania with the Appearance of Nonmetallic Properties,” Science, Vol. 281, No. 5383, 1998, pp. 1647-1650. doi:10.1126/science.281.5383.1647

[9]   X. Y. Xu, K. K. Caswell, E. Tucker, S. Kabisatpathy, K. L. Brodhacker and W. A. Scrivens, “Size and Shape Separation of Gold Nanoparticles with Preparative Gel Electrophoresis,” Journal of Choromatography A, Vol. 1167, No. 1, 2007, pp. 35-41. doi:10.1016/j.chroma.2007.07.056

[10]   N. Nath and A. Chilkoti, “A Colorimetric Gold Nanoparticle Sensor to Interrogate Biomolecular Interactions in Real Time on a Surface,” Analytical Chemistry, Vol. 74, No. 3, 2002, pp. 504-509. doi:10.1021/ac015657x

[11]   K. Esumi, T. Matsumoto, Y. Seto and T. Yoshimura, “Preparation of Gold-, Gold/Silver-Dendrimer Nanocomposites in the Presence of Benzoin in Ethanol by UV Irradiation,” Journal of Colloid and Interface Science, Vol. 284, No. 1, 2005, pp. 199-203. doi:10.1016/j.jcis.2004.09.020

[12]   H. J. Jiang, K. Moon and C. P. Wong, “Synthesis of Ag-Cu Alloy Nanoparticles for Lead-Free Interconnect Materials,” Proceedings of International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, 16-18 March 2005, pp. 173-177. doi:10.1109/ISAPM.2005.1432072

 
 
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