JMMCE  Vol.11 No.7 , July 2012
Preparation and Characterization of Electrically and Thermally Conductive Polymeric Nanocomposites
Abstract: The dielectric properties of composites and nanocomposites composed of epoxy resin as base matrix and AlN (Aluminum Nitride) as micro and nanofiller has been studied at variable loading of AlN. To improve the dispersion of the filler within the polymer matrix, AlN was surface modified with silane coupling agent (SCA). The thermal conductivity behavior of epoxy/AlN composites and nanocomposites has been studied at variable percentage of filler and temperatures. Test result indicated an increase of thermal conductivity of the composites at 20 wt% of AlN. Also, silane treated composites exhibited improved electrical conductivity properties wherein the electrical insulation property decreased in terms of di-electric strength and resistivity.
Cite this paper: M. Choudhury, S. Mohanty, S. Nayak and R. Aphale, "Preparation and Characterization of Electrically and Thermally Conductive Polymeric Nanocomposites," Journal of Minerals and Materials Characterization and Engineering, Vol. 11 No. 7, 2012, pp. 744-756. doi: 10.4236/jmmce.2012.117062.

[1]   Kim W., Bae J. and Choi I., 1999, “Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation.” Polymer Engineering and Science, Vol.39, No.4, pp.756-766,

[2]   Ohashi M., Kawakami S., Yokogawa Y. and Lai G.C., 2005, “Spherical Aluminum Nitride Fillers for Heat-Conducting Plastic Packages.”Journal of the American Ceramic Society. Volume 88, Issue 9, pp. 2615–2618.

[3]   Procter P. and Solc J., 1991, “Improved thermal conductivity in microelectronic encapsulants.” IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol 14, No. 4, pp. 708-713.

[4]   Bujard P., Kuhnlein G., Ino S. and Shiobara, 1994, “Thermal conductivity of molding compounds for plastic packaging.” IEEE Transactions on Components Packaging and Manufacturing Technologies Part A, Vol. 17, No. 4, pp. 527–532.

[5]   Wong C. P. and Bollampally R. S., 1999, "Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging." J. Applied Polymer Science, Vol. 74, pp. 3396–3403.

[6]   Sim L.C., Ramanan S.R., Ismail H., Seetharamu K.N. and Goh T.J., 2005, “Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes”, Journal of Thermochimica Acta, Volume 430, Issue 1-2, pp. 155-165.

[7]   Lee G. W., Park M., Kim J., Lee J. I. and Yoon H. G., 2006, “Enhanced thermal conductivity of polymer composites filled with hybrid filler.” Composite A, Applied Science & Manufacturing, Vol. 37, Issue 5, pp. 727–734.

[8]   Lee G. W., Lee J. I., Lee S. S., Park M. and Kim, 2005, “Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate”, Journal of Polymer Science, Part B: Polymer Physics, Vol. 40, pp. 1259–1263.

[9]   Hatsuo I. and Rimdusit S., 1998, “Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine”. Thermochim Acta, Vol. 320, Issue 1-2, pp. 177-186.

[10]   Nagai Y. and Lai G. C., 1997, Journal of the American Ceramic Society, Vol. 105, pp. 197–200

[11]   Hsieh C. and Chung S., 2006, “High thermal conductivity epoxy molding compound filled with a combustion synthesized AlN powder.” Journal of Applied Polymer Science, Vol. 102, Issue 5, pp. 4734–4740.

[12]   Xie S., Zhu B., Li J., Wei X. and Xu Z., 2004, “Preparation and properties of polyimide/aluminum nitride composites.” Polymer Testing, Vol.23, Issue 7, pp. 797–801.

[13]   Yu S. Z., Hing P. and Hu X., 2002, “Thermal conductivity of polystyrene-aluminum nitride composite.” Composite A, Applied Science Manufacturing, Vol 33, No. 2, pp. 289–292.

[14]   Xu Y. S., Chung D. D. L. and Mroz C, 2001, “Thermally conducting aluminum nitride polymer-matrix composites.”Composite A, Applied Science Manufacturing, Vol. 32, Issue 12, pp. 1749–1757.

[15]   Xu Y. S. and Chung D. D. L, 2000, “Increasing the thermal conductivity of boron nitride and aluminium nitride particle epoxy matrix composites by particle surface treatments.” Compos Interfaces, Vol. 7, No. 4, pp. 243–256.

[16]   Wang J. J. and Yi X. S., 2004, “Effects of Interfacial Thermal Barrier Resistance and Particle Shape and Size on the Thermal Conductivity of AlN/PI Composites.” Composite Science Technology, Vol. 64, pp. 1623–1628.

[17]   Bae J. W., Kim W., Cho S. H. and Lee S. H., 2000, “The properties of AlN-filled epoxy molding compounds by the effects of filler size distribution.” Journal of Material Science, Vol. 35, No. 23, pp. 5907–5913.

[18]   Pezzotti G., Kamada I. and Miki S., 2000, Journal Eur Ceram Soc, Vol. 20, pp. 1197–1203.

[19]   Kume S, Yamada I, Watari K, Harada I and Mitsuishi K., 2009, “High-thermal-conductivity AlN filler for polymer/ceramics composites.” Journal of the American Ceramic Society, pp. 153–156

[20]   Ohashi M., Kawakami S., Yokogawa Y. and Lai G., 2005, “Spherical aluminum nitride fillers for heat-conducting plastic packages.” Journal of the American Ceramic Society, Vol. 88, No. 9, pp. 2615–8.

[21]   Peng W., Huang X., Yu J., Jiang P., Liu W., 2010, “Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites: Effect of nanoparticle surface modification.” Composites Part A, Vol. 41, pp. 1201–1209.

[22]   Singha S. and M. Joy Thomas, 2008, “Di-electric properties of Epoxy Nanocomposites.” IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 15, pp. 1070-9878.

[23]   Lin L. Y., Lee J. H., Hong C. E., Yoo G. H., and Advani S. G., 2006, Compos Sci Technol, Vol. 66, pp. 2116.

[24]   Park J. J., 2008. J. KIEEME, Vol.21, pp. 749.

[25]   Preghenella, M.; Pegoretti, A.; Migliaresi, 2005, “Thermo-mechanical characterization of fumed silica-epoxy nanocomposites”, Polymer, Vol. 46, No. 26, pp. 12065–12072.

[26]   Lee C. H. and Park J.J., 2010, “The properties of DSC and DMA for epoxy nano-and-micro mixture composites.” Transactions on electrical and electronic materials, Vol.11, No.2, pp. 69-72.