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 ENG  Vol.2 No.1 , January 2010
Analysis for Pull-In Voltage of a Multilayered Micro-Bridge Driven by Electrostatic Force
Abstract: A trial solution for bending deflection of a multilayered micro-bridge subject to a voltage induced load is presented. The relation between the applied voltage and the displacements of the micro-bridge in the pull-in state is analyzed by energy method. Furthermore, two analytical expressions about normalized displacement and pull-in voltage are carried out. It’s proved that the value of normalized displacement is not influenced by residual stress if axial and shear deformation is ignored. Finally, the theoretical results are compared with that of FEM, and they show good agreement.
Cite this paper: nullY. LIU, G. WANG and H. YANG, "Analysis for Pull-In Voltage of a Multilayered Micro-Bridge Driven by Electrostatic Force," Engineering, Vol. 2 No. 1, 2010, pp. 55-59. doi: 10.4236/eng.2010.21007.
References

[1]   H. Y. Ma, Y. H. Wang, M. L Wang, et al. “The sequential coupling analysis of a cantilever driving by electrostatic force in an optical switch,” Optical Instruments, Vol. 25, No. 3, pp. 17, 2003.

[2]   G. Li and N. R. Aluru, “Efficient mixed-domain analysis of electrostatic MEMS,” ICCAD, pp. 474, 2002.

[3]   T. Y. Zhang, Y. J. Su, C. F. Qian, et al. “Micro-bridge testing of silicon nitride thin films deposited on silicon wafers,” Acta Mater, Vol. 48, pp. 2843, 2000.

[4]   Y. Zhou, C. S. Yang, J. A. Chen, et al. “Investigation of Young’s modulus and residual stress of copper film micro- bridges by MEMS technology,” Modern Scientific Instruments, Vol. 4, pp. 45, 2003.

[5]   M. J. Wang, Y. Zhou, J. A. Chen, et al. “Measurements of elastic modulus and residual stress of nickel film by micro- bridge testing methods,” Electronic Components & Materials, Vol. 23, No. 12, pp. 13, 2004.

[6]   H. Yang, M. H. Bao, S. Q. Shen, et al. “The displacement characteristics of the micromechanical structures driven by electrostatic force,” Journal of Fudan University (Natural Science), Vol. 38, No. 3, pp. 282, 1999.

[7]   H. Rong, Q. A. Huang, M. Nie, et al. “An analytical model for pull-in voltage of doubly-clamped multi-layer beams,” Chinese Journal of Semiconductors, Vol. 24, No. 11, pp. 1185, 2003.

[8]   D. H. Sun, Y. Q. Huang, W. Zheng, et al. “On the modeling methodology of MEMS system-level simulation,” Journal of Xiamen University (Natural Science), Vol. 40, No. 2, pp. 297, 2001.

[9]   M. Nie, Q. A. Huang, J. H. Wang, et al. “Analysis of deflection and pull-in voltage of a multi-layer cantilever under an electrostatic load,” Chinese Journal of mechanical engineering, Vol. 40, No. 8, pp. 72, 2004.

[10]   Y. Y. Wang, T. I. Kamins, B. Y. Zhao, et al. Polysilicon Film and its Application in IC (2nd Version), Science Press, Beijing, 2001.

[11]   C. S. Wang, W. B. Zhang, J. Fang, et al. “Research on coupled electro-mechanical analysis and application for typical components in MEMS,” Journal of Mechanical Strength, Vol. 23, No. 4, pp. 503, 2001.

[12]   P. M. Osterberg, S. D. Senturia, “M-test: A test chip for MEMS material property measurement using electrostatically actuated test structures,” Journal of Microelectromechanical Systems, Vol. 6, No. 2, pp. 107, 1997.

 
 
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