JECTC  Vol.9 No.1 , March 2020
Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel
Abstract: This paper aims to model a subcooled flow boiling in a vertical stainless-steel micro-channel with an upward flow in 1 mm diameter, 40 mm length and 0.325 mm thickness tube. Water has been considered as a working fluid. The heat flux varies from 600 - 750 kW·m-2, input velocity from 1 - 2 m·s-1, and the subcooled temperature varies from 59.6 - 79.6 K. The working pressure and saturation temperature are 1 atm and 372.75 K, respectively. The results show that, the flow boiling keeps the temperature of the channel wall lower and more uniform than a single-phase flow, as long as the flow boiling does not reach the dry-out point. The onset point of dry-out depends on three factors, heat flux, inlet velocity, and subcooled temperature. In addition, the dry-out occurs at a point near the channel inlet with increased heat flux and subcooled temperature. Decreasing the inlet velocity would also cause the dry-out point to shift closer to the inlet of the channel.
Cite this paper: Abbasinejad, H. and Hoseini Abardeh, R. (2020) Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel. Journal of Electronics Cooling and Thermal Control, 9, 1-21. doi: 10.4236/jectc.2020.91001.

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