STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials
Kevin R. Anderson, Matthew Devost, Watit Pakdee, Niveditha Krishnamoorthy

J. Electron. Cooling. Therm. Control Vol.3 No.4, December 17, 2013
DOI:10.4236/jectc.2013.34016

Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions
Yasushi Koito, Yoshihiro Kubo, Toshio Tomimura

J. Electron. Cooling. Therm. Control Vol.3 No.4, December 06, 2013
DOI:10.4236/jectc.2013.34015

Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon
Hiroyuki Toyoda, Yoshihiro Kondo

J. Electron. Cooling. Therm. Control Vol.3 No.4, December 06, 2013
DOI:10.4236/jectc.2013.34014