Prof. Li Junhui

School of Mechanical and Electronical Engineering

Central South University, China



2003–2008 Ph.D., Central South University, China

2000–2003 M.Eng., Central South University, China

1988–1992 B.Eng., Central South University, China

Publications (Selected)

  1. Li Junhui, Zhang Xiaolong, Liu Linggang, and Han Lei, “Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging”, IEEE/ASME Journal of Microelectromechanical Systems, Vol.22, No.3, Jun, 2013, Pages 560-568.
  2. Gen Chen, Fashen Chen, Xiaohe Liu, Wei Ma, Hongmei Luo, Junhui Li٭, Renzhi Ma, Guanzhou Qiu, “Hollow spherical rare-earth-doped yttrium oxysulfate: a novel structure for upconversion”, Nano Research, Vol.7, No.8, 2014, Pages 1093-1102.
  3. J. Li, L. Han, J. Duan, J. Zhong, “Interface mechanism of ultrasonic flip chip bonding”, Applied Physics Letters, Vol.90, 2007, Pages 242902.
  4. Li Junhui, Deng Luhua, Ma Bangke, and Han Lei, “Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging”, Microelectronics Reliability, Vol.51, 2011, Pages 2236-2242.
  5. Junhui Li, Bangke Ma, Ruishan Wang, “Study on A Cooling System Based on Thermoelectric Cooler for Thermal Management of High-power LEDs”, Microelectronics Reliability, Vol.51, 2011, Pages 2210-2215.
  6. Junhui Li, Liu Linggang, Deng Luhua, Ma Bangke, Wang Fuliang, Lei Han, “Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding”, IEEE Electron Device Letters, Vol. 32, No.10, 2011, Pages 1433-1435.
  7. Junhui Li, Liu Linggang, Ma Bangke, Deng Luhua, Lei Han, “Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process”, IEEE Electron Device Letters, Vol. 32, No. 12, 2011, Pages 1731-1733.
  8. Li Jun-Hui, Wang Ruishan, Han Lei, Wang Fuliang, Long Zhili, “HRTEM And X-Ray Diffraction Anylsis Of Au Wire Bonding Interface In Microelectronics Packaging”, Solid State Sciences,Vol. 13, 2011, Pages 72-76.
  9. Junhui Li, Wang Fuliang, Lei Han and Jue Zhong, “Theoretical and Experimental Analyses of Atom Diffusion Characteristics on Wire Bonding Interfaces”, Journal of Physics D: Applied Physics, Vol. 41, 2008, Pages 135303.
  10. Junhui Li, Lei Han, Jue Zhong, “Observations on HRTEM features of thermosonic flip chip bonding interface”, Materials Chemistry and Physics, Vol. 106, No.2-3, 2007, Pages 457-460.
  11. Li Junhui, Wang Ruishan, He Hu, Wang Fuliang, Han Lei, Zhong Jue, The Law of Ultrasonic Energy Conversion in Thermosonic Flip Chip Bonding Interface, Microelectronic Engineering, Vol. 86, 2009, Pages 2063-2066.
  12. Junhui Li, Lei Han, Jue Zhong, “Power and Interface Features of Thermosonic Flip Chip Bonding”, IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, 2008, Pages 442-446.
  13. Li Jun-Hui, Duan Ji-an, Han Lei, Zhong Jue, “Microstructural characteristics of Au/Al bonded interfaces”, Materials Characterization, Vol. 58, 2007, Pages 103-107.
  14. Junhui Li, Lei Han, Jue Zhong, “Short-Circuit Diffusion of Ultrasonic Bonding Interfaces in Microelectronic Packaging”, Surface and Interface Analysis, Vol. 40, No.5, 2008, Pages 953-957.
  15. Li Junhui, Zhang Xiaolong, Liu Linggang, Deng Luhua, and Han Lei, “Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip-Chip Bonding”, IEEE Transation on Components, Packaging and Manufacturing Technology, Vol. 2, No. 3, 2012, Pages 521-526.