Prof. Xiaobing Luo

Huazhong University of Science and Technology, China



2002 Ph.D., Engineering Mechanics, Tsinghua University, China

1998 M.S., Engineering Thermophysics, Huazhong University of Science and Technology, China

1995 B.S., Engineering Thermophysics, Huazhong University of Science and Technology, China

Publications (selected)

  1. Xiao-Bing Luo, Hye-Jung Cho, Valveless small gas pump, Nanoscale and Microscale Thermophysical Engineering, 10 (2) (2006): 83-94
  2. Xing Yang, Zhaoying Zhou, Hyejung Cho, Xiaobing Luo, Study on a PZT-actuated diaphragm pump for air supply for micro fuel cells, Sensors and Actuators A, Physical, 130-131(2006): 531-536
  3. X. B. Luo, Z. X. Li, Z. Y. Guo, Y. J. Yang, Study on linearity of a micromachined convective accelerometer, Microelectronic Engineering, 65(1-2) (2003): 87-101
  4. X. B. Luo, Z. X. Li, Z. Y. Guo, Y. J. Yang, Thermal optimization on micromachined convective accelerometer, Heat and Mass Transfer, 38(7-8) (2002): 705-712
  5. X. B. Luo, Z. X. Li, Z. Y. Guo, Principle and simulation on a novel valveless micropump, China Mechanical Engineering, 13(15) (2002): 1261-1264 (In Chinese)
  6. X. B. Luo, Y. J. Yang, F. Zheng, Z. X. Li, Z.Y. Guo, An optimized micromachined convective accelerometer with no proof mass, Journal of Micromechanics and Microengineering, 11(5) (2001): 504-508
  7. Xiaobing Luo, Bulong Wu, Sheng Liu, Effects of Moist environments on LED module reliability, IEEE Transactions on Device and Materials Reliability, Vol. 10 (2): 182-186, 2010
  8. Xiaobing Luo*, Zhangming Mao, Sheng Liu, An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging, Thermochim. Acta (2010), doi:10.1016/j.tca.2010.10.009
  9. Ting Cheng,Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis and optimization of multiple LED packaging based on a general analytical solution, International Journal of Thermal Sciences, 49 (2010):196-201.(* Corresponding author)
  10. Yanyan Xi,Xiaobing Luo*, Wenming Liu, Mingxiang Cheng, Sheng Liu, Studyon localized induction heating for wafer level packaging, Science in China Series E-Technological Sciences, Vol. 53(3):800-806, 2010 (*Corresponding author)
  11. Xuefang Wang, Chuan Liu, Zhuo Zhang, Sheng Liu, Xiaobing Luo*, A micro-machined Pirani gauge for vacuum measurement of ultra-small sized vacuum packaging, Sens. Actuators A: Phys. (2010), Vol.161, pp: 108-113 (* Corresponding author)
  12. Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, Sheng Liu. Design of compact freeform lens for application specific light-emitting diode packaging. Optics Express, 2010, 18: 413-425
  13. Kai Wang, Dan Wu, Fei Chen, Zongyuan Liu, Xiaobing Luo and Sheng Liu, Angular color uniformity enhancement of white light-emitting diodes integrated with freeform lenses, Optics Letters, Vol.35, No.11, pp.1860-1862, 2010
  14. Zongyuan Liu, Sheng Liu, Kai Wang, Xiaobing Luo. Measurement and numerical studies of optical properties of YAG: Ce phosphor for white LED packaging. Applied Optics, 2010, 49: 247-257
  15. Zongyuan Liu, Sheng Liu, Kai Wang,Xiaobing Luo. Comment on “Enhancement of flip-chip white light-emitting diode with a one- dimensional photonic crystal”. Optics Letters, 2010, 35: 1758
  16. Zongyuan Liu, Kai Wang,Xiaobing Luo, Sheng Liu. Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing. Optics Express, 2010, 18: 9398-9412
  17. Qin, Zong;Wang, Kai;Chen, Fei;Luo, Xiaobing;Liu, Sheng, Analysis of condition for uniform lighting generated by array of light emitting diodes with large view angle, Optics Express, v 18, n 16, p 17460-17476, August 2, 2010
  18. Chen, Fei;Wang, Kai;Qin, Zong;Wu, Dan;Luo, Xiaobing;Liu, Sheng, Design method of high-efficient LED headlamp lens, Optics Express, v 18, n 20, p 20926-20938, September 27, 2010
  19. Xiaobing Luo, Wei Xiong, Ting Cheng, Sheng Liu, Temperature estimation of high power LED street lamp by a multi-chip analytical solution, IETOptoelectronics, Vol. 3(5): 225-232, 2009
  20. L. L. Yuan, S. Liu, M. X. Chen, X. B. Luo, Thermal analysis of high power LED array packaging with microchannel cooler, Semiconductor Optoelectronics, 27(6), p712-716, December, 2006. (In Chinese)

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